| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiplayer printed wiring board which is suitable for a circuit constitution of an application for supplying a relatively large current while a thermoplastic resin is forming in an insulator layer or a circuit constitu tion or the like required for a high-speed operation and which has high reliabil ity and to provide a method for manufacturing capable of manufacturing such a multiplayer printed wiring board. SOLUTION: The multiplayer printed wiring board comprises a conductor pattern 2b disposed between a thermoplastic resin layer 1a of a printed wiring board and a thermoplastic resin layer 1b. The substrate further comprises a conductor pattern 2a disposed on the layer 1a. The substrate also comprises a connecting through-hole 3a formed through the pattern 2a and the layer 1a, and a conductive composition 4a filled and embedded in the through-hole 3a so as to electrically connect the pattern 2a to the pattern 2b. |
