| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the reliability of the fixation of a semiconductor element to a package decreases as the semiconductor element is downsized. SOLUTION: The package for semiconductor element storage comprises an insulating base body 1 which has a recessed part 1a where the semiconductor element 3 is mounted and a wiring conductor 7 led out of the recessed part 1a to an external surface on its top surface and a lid body 2, and the semiconductor element 3 is airtightly stored in the recessed part 1a of the insulating base body 1; and the insulating body 1 is provided with a plurality of metal layers 9 penetrating the base body from the bottom surface of the recessed part 1a to the reverse surface, a hollow 9a is formed in the surfaces of the through metal layers 9 which are exposed to the bottom surface side of the recessed part 1a, and the hollow surface has 2 to 5μm in mathematical mean roughness. |
