| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having excellent connecting reliability and to provide a method for manufacturing the same. SOLUTION: The wiring board comprises a conductor circuit having two or more conductor layers insulated by an insulating resin layer and electrically connected through a via hole. The method for manufacturing the wiring board comprises the steps of forming the via hole in an integral laminated obtained by laminating the wiring board having conductors formed on at least on an inner wall of the via hole and constituted of electroless copper plating and copper plating, a copper foil to become first conductor circuit on both side surfaces of the first insulating layer, and a copper foil to become a second conductor circuit, electrically connecting the copper foils to become the first conductor circuit to the second conductor circuit by electroless nickel plating and copper plating, forming the first conductor circuit, and forming the second conductor circuit. |
