| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a quality of a through hole is reduced due to occurrence of an interface release on an adhesive surface caused by a weak adhesive strength of an embedding resin to a conductor plating layer 2 formed on the resin in a step of embedding an insulation resin in a via through hole in a manufacturing step and to enhance density of wirings. SOLUTION: A method for manufacturing a multilayer printed wiring board comprises the steps of perforating and forming the through hole up to a depth including a core material from a surface conductor layer, forming a filled through hole for embedding a plating copper in the hole by a plating method, disposing a filled via for embedding the plating copper in the via hole directly above the same position as the filled through hole, and repeatedly forming the filled via directly above the filled via. Thus, the quality of the through hole is stabilized, and dispositions of the through hole and the filled via of each layer is superposed in a directly above perpendicular direction, and hence the density of the wirings can be enhanced. |
