发明名称 |
METHOD FOR PRODUCING EPITAXIAL SUBSTRATE, METHOD FOR FABRICATING SEMICONDUCTOR ELEMENT, AND EPITAXIAL SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a high quality semiconductor epitaxial substrate while up scaling a semiconductor material producing only a small size crystal to practical size. SOLUTION: The method for producing an epitaxial substrate comprises a step for preparing a supporting substrate 300, a step for preparing a plurality of planar crystal substrates 201-204, a step for implanting ions from one major surface of the crystal substrates 201-204 to form ion implantation layers 201c-204c, a step for pasting the plurality of crystal substrates 201-204 and the supporting substrate 300 one another, a step for separating the plurality of crystal substrates 201-204 into a plurality of thin film tiles 201a-204a bonded to the first major surface and a plurality of parent material side crystal substrates 201b-204b by heat treatment, and a step for growing a single crystal layer 301 epitaxially on the sauce of the thin film tiles 201a-204a.
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申请公布号 |
JP2003068592(A) |
申请公布日期 |
2003.03.07 |
申请号 |
JP20010251585 |
申请日期 |
2001.08.22 |
申请人 |
TOSHIBA CORP |
发明人 |
SAKAI TADASHI;ONO TOMIO;SAKUMA HISASHI;SUZUKI MARIKO |
分类号 |
H01L21/205;H01L21/02;H01L21/265;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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