| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect a semiconductor chip against damage at the time of spreading a dicing tape or picking up the semiconductor chip following to dicing even if a wafer is made thin. SOLUTION: A dicing tape 1 is provided with through holes 2 of microdiameter over the entire surface thereof. When a wafer 3 pasted to the dicing tape 1 is diced into semiconductor chips 3a and then the dicing tape 1 is spread, diameters of the through holes 2 are enlarged because the dicing tape 1 is spread in all directions. Consequently, air spreads through the enlarged through holes 2 to the rear sides of the semiconductor chips 3a and adhesion between the semiconductor chips 3a and the dicing tape 1 is relaxed thus facilitating stripping of the semiconductor chips 3a from the dicing tape 1.</p> |
