SEMICONDUCTOR DEVICE FOR MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide technology for inspecting a conduction state between the electrode pads of a semiconductor chip and the electrode pads of a wiring board in a semiconductor device adopting phase down mounting. SOLUTION: The semiconductor device has the semiconductor chip 1 having a plurality of first electrodes pads arranged on one main face and first inspection electrode pads 11a to 11h arranged on one main face, the wiring board 2 having a plurality of second electrode pads arranged in accordance with a plurality of first electrode pads on one main face and second inspection electrode pads 21a to 21h arranged in accordance with the first inspection electrode pads on one main face and connection means 13a to 13d and 25a to 25f which are installed between a plurality of first electrode pads and the first inspection electrode pads, and between a plurality of second electrode pads and the second inspection electrode pads and which electrically connect them.