| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive fine particle and a conductive connection structure capable of keeping the distance between facing boards or the like constant because of using a resin particle having a small distribution in diameter as a base material fine particle, having so excellent elasticity as to prevent stress from being easily imposed on a jointing part when it is used for a conduc tive joint, and capable of relaxing shearing stress due to displacement of a relative position between electrodes caused by thermal expansion and contraction of a board, an element or the like due to temperature variation. SOLUTION: This conductive fine particle is formed by covering the surface of the base material fine particle formed of a resin with one or more metal layers. In the conductive fine particle, the sphericity of the base material fine particle is 5% or below.
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