| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for semiconductor device such as the TAB tape of a very fine pitch, whose bottom width of a circuit wiring pattern is not more than 20μm and whose distance between adjacent circuit wiring patterns is not more than 20μm. SOLUTION: In the tape carrier for semiconductor device, which has structure where a copper circuit wiring pattern 7 is formed on one face of an insulating tape base material 4 or on both faces by using a subtracting method. The bottom width of the circuit wiring pattern is 10μm to 20μm and the distance between the adjacent circuit wiring pattern is 10μm to 20μm. Copper foil 3 whose thickness is 5μm to 10μm is used for forming the circuit wiring pattern 7.
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