PIEZOELECTRIC DEVICE, MOBILE PHONE UTILIZING THE PIEZOELECTRIC DEVICE AND ELECTRONIC DEVICE UTILIZING THE PIEZOELECTRIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a piezoelectric device that has particularly excellent resistance to shocks applied from the side even when the device is formed small in size and to provide a mobile phone and an electronic device employing the device. SOLUTION: The piezoelectric device is provided with a rectangular package 36 that fixes a piezoelectric vibration chip 32 in cantilever fashion and contains the chip 32 in its inside and a cover 39 fixed with a brazing filler metal 33 at an upper end of the package. Each corner 81 of the package is shaped to be a curve or a chamfered shape so that a circumferential edge of the rectangular package 36 and an outer circumferential edge of the cover 39 are spaced by a prescribed size.