发明名称 |
METHOD FOR DETECTING WHETHER ACF IS PASTED |
摘要 |
PROBLEM TO BE SOLVED: To detect whether an ACF is pasted on a group of leads formed on a substrate, by a simple structure. SOLUTION: Using a television camera 36 for detecting the positional deviation of an electronic circuit component 7 when placing the electronic circuit component 7 mounted on a liquid crystal cell 1 on a PCB placement section 17 of a transportation unit 13, a group of leads 6 of a PCB 5 are formed and, at the same time, an image of a part where an ACF 10 is pasted is obtained. With a difference in density which comes from a contrast between a pattern of a lead 6a before the ACF 10 is pasted and a ground of a substrate being a reference difference in density, a pattern of the lead 6a actually measured after the ACF 10 is pasted and the ground of the substrate are compared for a difference in actually measured density to judge whether the ACF 10 is actually pasted or not.
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申请公布号 |
JP2003069199(A) |
申请公布日期 |
2003.03.07 |
申请号 |
JP20010260618 |
申请日期 |
2001.08.30 |
申请人 |
HITACHI ELECTRONICS ENG CO LTD |
发明人 |
HIRASAKO KOUJI;SUZUKI MASAMITSU;WADA TAKESHI |
分类号 |
G01N21/956;G01M11/00;G02F1/13;G02F1/1345;G09F9/00;H01R43/00;H05K1/02;H05K3/32;H05K3/36;(IPC1-7):H05K3/32;G02F1/134 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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