发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve connecting reliability of a first conductor wiring to a second conductor wiring in a double-side wiring board using a glass epoxy board. SOLUTION: The wiring board comprises the first conductor wiring provided on a first main surface of a tape-like insulating board, and the second conductor wiring provided on a second main surface opposed to the first main surface of the insulating board to be electrically connected to the first wiring. In this wiring board, the insulating board is a board made of a fibrous insulating base and an insulating resin. The first and second wirings are electrically connected by a conductive material filed in an opening provided by punching the insulating board by a die.
申请公布号 JP2003069175(A) 申请公布日期 2003.03.07
申请号 JP20010254649 申请日期 2001.08.24
申请人 HITACHI CABLE LTD 发明人 ONDA MAMORU;YAMADA HIROSHI;SATO TAKASHI
分类号 H05K1/11;H01L23/14;H05K3/00;H05K3/06;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K1/11
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