发明名称 |
Electronic component with at least two stacked semiconductor chips, and fabrication method |
摘要 |
An electronic component is formed with at least two semiconductor chips disposed on a carrier substrate. Active chip surfaces of the semiconductor chips comprise central contact surfaces, respectively, on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from the chips to the carrier substrate.
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申请公布号 |
US2003042591(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020232173 |
申请日期 |
2002.08.30 |
申请人 |
GOLLER BERND;OFNER GERALD;THUMBS JOSEF;WORNER HOLGER;HAGEN ROBERT-CHRISTIAN;STUMPFL CHRISTIAN;WEIN STEFAN |
发明人 |
GOLLER BERND;OFNER GERALD;THUMBS JOSEF;WORNER HOLGER;HAGEN ROBERT-CHRISTIAN;STUMPFL CHRISTIAN;WEIN STEFAN |
分类号 |
H01L25/065;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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