LAYERED CIRCUIT BOARDS AND METHODS OF PRODUCTION THEREOF

摘要

Compositions and methods are provided whereby layered materials, electronic components and electronic products may be produced comprising: a substrate (10), an active component layer (20) that comprises an active material coupled to an adhesion promoter layer (30), wherein the adhesive promoter layer is selectively patterned to expose a contact area on the active material; and at least an additional layer (40).