LEAD FRAME CLAMPING APPARATUS FOR WIRE BONDING

摘要

PURPOSE: A lead frame clamping apparatus for wire bonding is provided to perform automatically a horizontal control operation of a clamping plate by improving a clamping apparatus. CONSTITUTION: A clapping device includes a clamping plate(40) and a fixing plate. The clamping plate(40) is formed with a clamping block(41), two side blocks(51,53), a fixing block(60) fixing a side block, and a base block. The clamping block(41) includes a window(42) for exposing a wire bonding region. A projection portion(43) is formed around the window(42). A plurality of shafts(44,45) are formed at edges of both sides of the clamping block(41). The fixing block(60) is fixed between the side blocks(51,53) by using screws(61,62). A shaft(63) is installed in a center portion of the fixing block(60). A bearing(71) is combined with the shaft(63). A plurality of fixing screw holes(72,73) are formed on the base block.