发明名称 Variable thickness stamper for creation of flat molded substrates
摘要 The invention is directed toward techniques for creating molded substrates for use in various different data storage media. The molded substrates have improved thickness profiles that can improve media quality, and in some cases facilitate higher data storage densities. In many cases, the improved thickness profile is a thickness profile that has improved flatness. Mechanical flatness or optical flatness can be achieved. In particular, optical flatness is desirable for substrates used in holographic data storage media having a sandwiched construction.
申请公布号 US2003043731(A1) 申请公布日期 2003.03.06
申请号 US20010946011 申请日期 2001.09.04
申请人 IMATION CORP. 发明人 KERFELD DONALD J.;CHAPUT DOUGLAS J.;EDWARDS JATHAN D.;SANDSTROM CHAD R.
分类号 G03H1/02;B29C45/26;B29C45/76;B29D17/00;B29L17/00;G11B5/84;G11B7/0065;G11B7/24;G11B7/26;(IPC1-7):G11B3/70;B28B1/14;B29C39/00;B29C39/02;B29C39/22;B29C41/00;B29C41/02;B29C41/34 主分类号 G03H1/02
代理机构 代理人
主权项
地址