发明名称 |
Wire connection structure and method of manufacturing the same |
摘要 |
A wire connection structure has light-emitting points formed by third electrodes and second electrodes, each second electrode being electrically connected to a first electrode functioning as a lead-out electrode by way of an electro-conductive member, and comprises electro-conductive members for respectively connecting the second electrodes and the first electrodes. The electro-conductive members are formed either by an ink-jet method or a gas deposition method. Thus, an electro-conductive member directly contacts with an end of each of the first electrodes to establish an excellent electric connection between the first electrode and the corresponding second electrode without using an insulating member.
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申请公布号 |
US2003045016(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020191565 |
申请日期 |
2002.07.10 |
申请人 |
SAITO YASUYUKI;OMIZU SATOKO |
发明人 |
SAITO YASUYUKI;OMIZU SATOKO |
分类号 |
B41J2/44;B41J2/45;B41J2/455;G02F1/1345;G03G15/04;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H01L51/52;H05B33/06;H05K1/14;(IPC1-7):H01L21/00 |
主分类号 |
B41J2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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