发明名称 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods |
摘要 |
A routing element for use with a multi-chip module. The routing element includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multi-chip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multi-chip module. Multi-chip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used. |
申请公布号 |
US2003042585(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20010942183 |
申请日期 |
2001.08.29 |
申请人 |
CORISIS DAVID J.;BROOKS JERRY M.;SCHWAB MATT E.;REYNOLDS TRACY V. |
发明人 |
CORISIS DAVID J.;BROOKS JERRY M.;SCHWAB MATT E.;REYNOLDS TRACY V. |
分类号 |
H01L23/538;H05K1/14;H05K3/30;H05K3/40;(IPC1-7):H01L27/10;H01L23/495;H01L23/02;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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