发明名称 |
Electronic component with at least two stacked semiconductor chips and process for producing the electronic component |
摘要 |
An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.
|
申请公布号 |
US2003043555(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020231883 |
申请日期 |
2002.08.30 |
申请人 |
GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUMPFL CHRISTIAN;THUMBS JOSEF;WEIN STEFAN;WORNER HOLGER |
发明人 |
GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUMPFL CHRISTIAN;THUMBS JOSEF;WEIN STEFAN;WORNER HOLGER |
分类号 |
H01L25/065;(IPC1-7):H05K7/02;H05K7/06;H05K7/08;H05K7/10 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|