发明名称 |
Manufacturing method of semiconductor integrated circuit device |
摘要 |
A foreign-matter removal capacity is improved in a cleaning process. When a wafer is cleaned while a brush is moved from the center of the wafer toward the outer circumference thereof, a discharge flow rate of cleaning liquid flowing into the brush is regulated so that the interval between the brush and the wafer is kept constant.
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申请公布号 |
US2003041878(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020083402 |
申请日期 |
2002.02.27 |
申请人 |
HITACHI, LTD. |
发明人 |
SHIMADA YUTAKA;MORI YASUHIRO;MORITA KOYO;YOKOSHIMA KENJI |
分类号 |
H01L21/304;B08B1/00;B08B1/04;H01L21/00;(IPC1-7):B08B7/04 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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