Process for plating particulate matter

摘要

A process for electrolessly plating particulate matter is disclosed wherein the particulate and the electroless plating solution, without a reducing agent component, are combined with agitation in a plating vessel. If necessary, activator species are added directly to the plating solution. The reducing agent component is then added to the plating solution to initiate plating. Reliable plating upon the particulate, without instability of the plating solution, is achieved.