Microelectronic devices and methods of manufacture

摘要

Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have a longer first dimension (62) and a shorter second dimension (64). In some embodiments, a method of filling the underfill gap (70) employs a removable stencil (80). If so desired, a stencil (80) can be used to fill multiple underfill gaps through multiple underfill apertures in a single pass.