发明名称 |
LOW VOC LAMINATING FORMULATIONS |
摘要 |
The invention is a formulation that contains: (1) a low-viscosity epoxy resin; (2) a phenolic chain extender whose concentration is less that 0.6 equivalents phenolic hydroxyl group per equivalent of the low-viscosity epoxy resin; (3) a catalyst that promotes self-curing reactions between epoxy groups; (4) an inhibitor that inhibits the activity of the catalyst under "B-staging" conditions; (5) less than 25 weight percent of a volatile organic solvent; and (6) optionally, a multifunctional cross-linking agent. The formulation contains low levels of volatile organic solvent, and can be used to make electrical laminates. It builds molecular weight controllably in B-staging, so that dripping is avoided but the prepreg can be easily laminated.
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申请公布号 |
US2003044521(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US19970817788 |
申请日期 |
1997.09.12 |
申请人 |
GAN JOSEPH;GOODSON ALAN R. |
发明人 |
GAN JOSEPH;GOODSON ALAN R. |
分类号 |
C08J5/24;B32B27/38;C08G59/06;C08G59/18;C08G59/62;C08G59/68;C08J3/09;C08K3/16;C08K3/22;C08K3/38;C08K5/13;C08K5/56;C08K13/02;C08L63/00;H05K1/03;(IPC1-7):B05D5/12 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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