METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, ESPECIALLY A MEMORY CHIP

摘要

The invention relates to a method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalise an integrated circuit by means of at least one laser via (15) in a layer at least partially covering the circuit. Said component comprises a rewiring of the contact pads. The inventive method comprises the following steps: each laser via is closed by means of a separate covering layer (16) which is to be applied locally; a rewiring extending between the local covering layers (16) is created; the local covering layers (16) are removed; and the laser-induced correction is carried out by means of the open laser vias.