发明名称 |
Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing |
摘要 |
The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
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申请公布号 |
US2003045010(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20010941761 |
申请日期 |
2001.08.30 |
申请人 |
BYRD PHILLIP E.;SHARRATT PAUL |
发明人 |
BYRD PHILLIP E.;SHARRATT PAUL |
分类号 |
G01R31/28;H01L23/58;(IPC1-7):G01R31/26;H01L21/66 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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