| 摘要 |
<p>A method of forming a circuit material (30) comprises disposing an adhesion promoting elastomer composition (34) between a conductive copper foil (36) and a thermosetting composition (32); and laminating the copper foil (36), adhesion promoting composition (34), and thermosetting composition (32) to form the circuit material (30). The adhesion promoting layer (34) may be uncured or partially cured before contacting with the curable thermosetting composition (32). Preferably the adhesion promoting layer (34) has electrical characteristics such as dissipation factor, dielectric breakdown strength, water absorption, and dielectric constant that are similar to and/or compatible with the electrical characteristics of the thermosetting composition (32).</p> |
