发明名称 |
Simultaneous offset dual sided laser shock peening using low energy laser beams |
摘要 |
A method for laser shock peening an article by simultaneously firing low energy first and second laser beams to form pairs of longitudinally spaced apart first and second laser shock peened spots that are on opposite sides of the article, simultaneously laser shock peened, and transversely offset from each other. Each of the low energy first and second laser beams having a level of energy of between 1-10 joules.
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申请公布号 |
US2003042234(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20010945191 |
申请日期 |
2001.08.31 |
申请人 |
SUH UI WON;MANNAVA SEETHARAMAIAH;ROCKSTROH TODD JAY |
发明人 |
SUH UI WON;MANNAVA SEETHARAMAIAH;ROCKSTROH TODD JAY |
分类号 |
C21D10/00;F01D5/28;(IPC1-7):B23K26/00 |
主分类号 |
C21D10/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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