发明名称 Positive photoresist composition
摘要 A positive photoresist composition comprises: a compound capable of generating an acid upon irradiation with an actinic ray or a radiation, in which the compound contains (A1) a sulfonate compound of a sulfonium, and (A2) a sulfonate compound of an N-hydroxyimide or a disulfonyldiazomethane compound; and a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developing solution, in which the resin contains a repeating unit having a specific lactone structure.
申请公布号 US2003044715(A1) 申请公布日期 2003.03.06
申请号 US20020116137 申请日期 2002.04.05
申请人 FUJI PHOTO FILM CO., LTD. 发明人 FUJIMORI TORU;KODAMA KUNIHIKO;SATO KENICHIRO;AOAI TOSHIAKI
分类号 C08F20/12;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039;G03F7/30 主分类号 C08F20/12
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