发明名称 |
Positive photoresist composition |
摘要 |
A positive photoresist composition comprises: a compound capable of generating an acid upon irradiation with an actinic ray or a radiation, in which the compound contains (A1) a sulfonate compound of a sulfonium, and (A2) a sulfonate compound of an N-hydroxyimide or a disulfonyldiazomethane compound; and a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developing solution, in which the resin contains a repeating unit having a specific lactone structure.
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申请公布号 |
US2003044715(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020116137 |
申请日期 |
2002.04.05 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
FUJIMORI TORU;KODAMA KUNIHIKO;SATO KENICHIRO;AOAI TOSHIAKI |
分类号 |
C08F20/12;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039;G03F7/30 |
主分类号 |
C08F20/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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