| 摘要 |
An apparatus for forming a film on a wafer comprising, a first coating apparatus coating a foaming insulation film material on the wafer, a second coating apparatus coating a non-porous insulation film material on the wafer, a low oxygen heating temperature regulating process apparatus performing a heating process on the wafer on which the foaming insulation film material is coated, a low oxygen high temperature heating process apparatus performing the heating process on the water on which the non-foaming insulation film material is coated, a transfer mechanism transferring the wafer to these apparatuses, and a selecting means selecting a path to which the wafer is transferred corresponding to the film formed on the wafer.
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