Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same

摘要

Disclosed is a resin composition comprising a thermosetting resin, a thermoplastic resin and a filler. The cured resin of the resin composition has a fine phase separated structure, and the filler is distributed in one of the thermosetting resin rich phase and the thermoplastic resin rich phase. The resin composition of the present invention permits obtaining an insulating layer, which has a high resistance to heat, has a high toughness, is small in thermal deformation, exhibits a high bonding strength with a copper wiring, and permits forming a fine pattern.