发明名称 HEATED SUBSTRATE SUPPORT ASSEMBLY AND METHOD
摘要 A substrate support assembly 30 comprises a support 38 with a substrate supporting surface 55 and a collar 130 comprising an electrical connector, whereby a voltage may be supplied to the collar 130 through the electrical connector. The collar 130 may pass a current therethrough to resistively heat the collar to a predetermined temperature before substrate processing. In another version, the temperature of the collar 130 may be controlled during and/or before substrate processing.
申请公布号 KR20030019607(A) 申请公布日期 2003.03.06
申请号 KR20037001033 申请日期 2003.01.23
申请人 发明人
分类号 H01L21/00;H05H1/46;C23C16/458;C23C16/46;H01L21/205;H01L21/3065;H01L21/683;H01L21/687 主分类号 H01L21/00
代理机构 代理人
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