Process for structuring a covering material for applying on a support substrate comprises preparing a planar plate as covering material and forming grooves on the material so that the grooves are arranged along dissection lines

摘要

Process for structuring a covering material for applying on a support substrate (5) comprises preparing a planar plate as covering material; and forming grooves (3) on the material so that the grooves are arranged along dissection lines (2) corresponding to a chip having an integrated component. Independent claims are also included for: (1) a process for assembling a component integrated in a support substrate; (2) a wafer or glass-silicon wafer composite having the above produced structure; and (3) a device for covering the component integrated in the support substrate. The covering material is made from a transparent material, preferably coated or structured glass, or plastic. The grooves are 200-500 microns wide and have a length which is shorter than the length of the corresponding dissection lines.