METHOD FOR FABRICATING CHIP SCALE PACKAGE SUBSTRATE BODY AND CHIP SCALE PACKAGE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for fabricating a chip scale package substrate body and a chip scale package semiconductor device is provided to fabricate a plurality of substrates by cutting the chip scale package substrate body. CONSTITUTION: A plurality of pad bars connected with bonding pads and an insulating member(14) are formed on a substrate body. A plurality of substrates are formed by cutting the substrate body. An adhesive(18) is coated on the substrates. A plurality of semiconductor chips(20) are adhered on the substrates. A connection pad formed on the semiconductor chip(20) is combined with a pad(17) by using a wire(22). The semiconductor chip(20) and the wire are sealed with a protective layer(24). The sealed semiconductor chips(20) are cut each piece.