DEVICE AND METHOD FOR HANDLING ELECTRONIC COMPONENT

摘要

PURPOSE: To provide a device for handling an electronic component in which an electronic component adhesion held by an electronic component holder can be removed without being damaged and a large number of removed electronic components can be collected surely while preventing mutual adhesion. CONSTITUTION: The device for handling an electronic component comprises an electronic component holder 3 for adhesion holding a large number of electronic components 2 on the lower surface 6a of an adhesive layer 6, and a blade 10 for separating the electronic component 2 from the adhesive layer 6 wherein the blade 10 is moved relatively by means of a driver along a direction parallel with the surface of the adhesive layer 6 while recessing the lower surface 6a thereof at the forward end 10a thereof.