发明名称 HEATER ASSEMBLY FOR HEATING WAFER
摘要 PURPOSE: A heater assembly for heating a wafer is provided to reduce a thermal difference between a center part and a peripheral part of a wafer and enlarge an exchange period of a heater. CONSTITUTION: A heater assembly(900) is formed with a heater(100), a power supply portion(200), and a support plate(300). The heater(100) is installed at a lower portion of a susceptor(400) for supporting a wafer(500) in order to supply the heat to the susceptor(400). The support plate(300) is used for supporting the power supply portion(200) and the heater(100). An insulating member(110) is formed in the inside of the heater(100). An input terminal(120) and an output terminal are formed at a peripheral portion of the heater(100). The power supply portion(200) has a lead portion(220), a power connection portion(240), and a control portion. The support plate(300) is formed with an upper support portion(310) and a lower support portion(320).
申请公布号 KR20030018290(A) 申请公布日期 2003.03.06
申请号 KR20010051930 申请日期 2001.08.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, HYEONG SIK;KUEM, GYEONG SU;PARK, CHUNG HUN;PARK, JAE HAN;SONG, EUN SEOK
分类号 H01L21/324;H01L21/00;H05B3/28;(IPC1-7):H01L21/324 主分类号 H01L21/324
代理机构 代理人
主权项
地址