| 摘要 |
The present invention is a technique to minimize crosstalk in multilayer IC packages. According to one or more embodiments of the present invention, signal routing layers are separated by planes for power and ground. Signal trace routing on the routing layers follows either horizontal, vertical or diagonal directions for obtaining high routing densities in the package as is the present design practice. The power and ground planes in one embodiment of the present invention are constructed as a mesh having groups of colinear perforations. The groups are oriented at an arbitrary angle that is chosen to minimize the crossings of groups of signals over mesh openings. It is guaranteed that the number of mesh openings that any given set of three traces encounters is reduced by at least a factor of two. Thus the present invention reduces crosstalk in the package by approximately 50%. |
