发明名称 |
METHOD FOR MAKING CIRCUIT ELEMENTS FOR A Z-AXIS INTERCONNECT |
摘要 |
<p>Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.</p> |
申请公布号 |
EP1038420(B1) |
申请公布日期 |
2003.03.05 |
申请号 |
EP19980918415 |
申请日期 |
1998.04.14 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
CHEN, YU;GERBER, JOEL, A.;SCHREIBER, BRIAN, E.;SMITH, JOSHUA, W. |
分类号 |
H05K3/32;H01L21/60;H01L23/498;H01L23/52;H05K3/28;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|