A method for applying a semiconductor chip to a substrate and an assembly obtained thereby

摘要

For assembling a semiconductor chip (1-5) and a substrate (10), an electrically conducting layer (6) is applied to each terminal pad (1) of the chip, said layer (6) extending from said pad onto the surface the chip for increasing the contacting surface of each pad. In this way, less precision is required for safely assembling said chip and substrate with the correct electrical connections and for high stability.