POLYMER COMPOSITION CONTAINING CLEAN FILLER INCORPORATED THEREIN

摘要

There is provided an elastomer composition which is prepared by using a very clean filler reduced in both of an amount of moisture generation and an amount of organic outgas generation and is suitable as a molding material for semiconductor production apparatuses and there is provided a molded article. The composition is a crosslinkable composition comprising a high molecular weight polymer, particularly a crosslinkable fluorine-containing elastomer and a filler which has a weight reduction ratio per unit surface area of not more than 2.5 x 10<-5> % by weight/m<2> when heating at 200 DEG C for two hours and a total amount of organic gas generated of not more than 2.5 ppm when heating at 200 DEG C for 15 minutes. The molded article is produced from the crosslinkable composition.