| 摘要 |
PROBLEM TO BE SOLVED: To provide an exposure method in the manufacturing process of a metal wiring pattern on a printed wiring board or the like by which the hardened resist pattern after being developed shows superior high resolution, an unsteady state of side walls in the pattern is avoided, and therefore, chipping in circuits or defects such as discontinuity or short circuits caused by the unsteady side walls are suppressed in an etching process or a plating process. SOLUTION: The following photosensitive resin layered body is used. The layered body consists of layers of a supporting body, a photosensitive resin layer containing a thermoplastic polymer binder, photopolymerizable monomers having specified polymerizable ethylenically unsaturated groups, a specified photopolymerization initiator and a specified hindered phenol compound, and a protective layer. In the method for manufacturing a metal wiring pattern, the supporting body is removed prior to the projection exposure. |
