| 摘要 |
The invention relates to a package 2 for electronic components 8, 10 comprising at least two substrates 4, 6. Each substrate supports an electronic component 8, 10. External connectors 34 provide external connection to the electronic components 8, 10. A non-conductive frame 12 supports the at least two substrates 4, 6 in a stacked arrangement, and the external connectors 34. Conductive lines 36, 38 extend over the non-conductive frame 12 for electrically coupling the electronic components 8, 10 to the external connectors 34. |
