| 摘要 |
<p>PROBLEM TO BE SOLVED: To electrically inspect an externally mounted IC without peeling it off in a substrate apparatus that is used, for example, as a TFT array substrate of a liquid crystal apparatus and the like. SOLUTION: The substrate apparatus is provided with a substrate, a peripheral circuit that is created on the substrate, and an externally mounted IC that has a first terminal that is externally mounted to the substrate while the first terminal is connected to a connection section that is provided on the first wiring. Further, the substrate apparatus comprises second wiring that is lead from the connection section for passing a section that opposes an externally mounted integrated circuit in regions on the substrate, and a first external circuit connection terminal that is provided on the second wiring at a section that does not oppose the externally mounted integrated circuit in regions on the substrate. The externally mounted IC can be inspected via the external circuit connection terminal.</p> |
