发明名称 MOLDING METHOD FOR BOARD PRODUCT AND MOLDING APPARATUS USED THEREIN
摘要 PROBLEM TO BE SOLVED: To simultaneously perform molding of a board substrate by heating/ compression of a fiber mat and adhesion of a skin material to the board substrate, and to secure a skin piece used for being entangled in the opening part of the board substrate. SOLUTION: In a method for molding a board product by molding the board substrate 14 having a predetermined shape by heating and compressing the fiber mat and bonding the skin material 16 to the board substrate, the ski material 16 is cut at a part corresponding to a place where the opening must be formed to the board substrate 14 to form the skin piece 18. Then, the opening part is formed to the board substrate 14 by the cutting blade provided at a position protruded from the skin piece 18. Further, the skin material 16 is bonded to the surface of the board substrate 14 simultaneously with the molding of the board substrate 14 and the skin piece 18 is subsequently involved toward the rear side of the board substrate 14 so as to cover the edge of the opening.
申请公布号 JP2003062846(A) 申请公布日期 2003.03.05
申请号 JP20010373364 申请日期 2001.12.06
申请人 ARACO CORP 发明人 HETA HITOSHI;NAGATANI TAMOTSU;TAKEUCHI KOICHI;ASAI NORIYUKI
分类号 B60R13/02;B29C43/18;B29C43/34;B29K103/00;(IPC1-7):B29C43/18 主分类号 B60R13/02
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