| 发明名称 |
EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE |
| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing an optical semiconductor capable of preventing transparency decrease and sealant resin deterioration. SOLUTION: This composition contains an epoxy resin and at least one compound represented by the formula below (1)-(3) wherein, R1-R7 is a hydrogen atom or a 1-4C alkyl group.
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| 申请公布号 |
JP2003064243(A) |
申请公布日期 |
2003.03.05 |
| 申请号 |
JP20010258665 |
申请日期 |
2001.08.28 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
TOYAMA TAKASHI;NAKASUJI IKUO;KUSHIDA TAKANORI |
| 分类号 |
C08L63/00;C08G59/42;C08K5/07;C08K5/134;C08K5/315;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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