| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition, a copper foil with resin and a printed circuit board having good dielectric properties and crack resistance. SOLUTION: The resin composition comprises a benzocyclobutene resin and an inorganic filler having a relative dielectric constant of 20 or less as essential components. The resin composition is applied on a metal foil to form the copper foil with resin. The copper foil with resin is superposed on one or both sides of an inner layer circuit board, and heated and pressurized to form the multilayer printed circuit board. |
