| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize arrangement constitution for wiring leads to enhance mechanical strength of a membrane, in a thin film sensor provided with a substrate, a polygonal membrane, in its top view, formed in one face side of the substrate, and a plurality of film-like wiring leads formed to cross a profile of the membrane in the one face of the substrate. SOLUTION: The membrane 32 is formed in the one face side of the substrate 10 by removing the other side of the substrate 10 partially, a conductor wiring 33 is formed on the membrane 32, and the plurality of wiring leads 101 connected electrically to the conductor wiring 33 is arranged to make portions astride the profile of the membrane 32 exist only in portions astride vertexes of the profile of the membrane 32.</p> |
