| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit for appropriately detecting a pin contact failure in a pin contact test in the semiconductor integrated circuit of a multi-chip package. SOLUTION: In a pin contact test, voltages that are to be supplied to the power supply nodes of input protection circuits 100 and 200 of chips CA and CB, respectively, are set to specific voltages by voltage control circuits 300 and 310. Then, a specific constant current If is supplied to an external pin PIN0, thus measuring voltages applied to the external pin PIN0. According to the result, the pin contact failure in the chips CA and CB can be detected.
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