发明名称 |
IMAGE PICKUP DEVICE, AND IMAGE PICKUP DEVICE ASSEMBLING METHOD |
摘要 |
The invention integrally arranges a lens, an optical filter, a semiconductor imaging device, on-chip components, and a printed circuit board on a three-dimensional circuit board and contrives the lens attachment structure, bonding method, color of an adhesive, masking of the lens, etc. in order to implement a structure that allows high performance, compact, lightweight and rigid design, and mass production, as well as a high-quality picture. <IMAGE> |
申请公布号 |
EP1289281(A1) |
申请公布日期 |
2003.03.05 |
申请号 |
EP20010906306 |
申请日期 |
2001.02.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ADACHI, YOSHIO,;SASAKI, SADASHI;KANEKO, TAMOTSU;HARAZONO, FUMIKAZU;KOBAYASHI, TATSUO |
分类号 |
G03B15/00;G02B7/02;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335 |
主分类号 |
G03B15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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