| 摘要 |
<p>A non-planar lead-frame 12 may include two parallel sections 14,18 and an intermediate perpendicular section 16. Magnetic components 24 may be connected by being mounted in the lead-frame on the shorter 14 of the two parallel sections and a circuit board 26 may be connected to and supported by the longer 18 of the parallel sections. A compressible foam material 32 between the magnetic component and circuit board provides mechanical robustness. The magnetic components 24 and circuit board 26 may be assembled onto a flat lead-frame, figure 1, which is folded about fold lines 36 into a U-shape, figure 2. The assembly may be housed in a compartment formed from walls 6, 8, a lid 4 and a heat sink 10, and may comprise a DC to DC converter. The lead-frame long parallel section 18 may form a heat path from the circuit board 26 to the heat sink 10. Compressible foam 34 may be located between the magnetic component 24 and the lid 4.</p> |
