发明名称 |
System and method for testing electronic device interconnections |
摘要 |
<p>A system and method of testing the quality of electronic device interconnections uses a pressure-sensitive medium. The interconnections of an electronic device are placed in contact with the pressure-sensitive medium. Force is then applied to the device so that an indication of the pressure exerted by each interconnection is produced by the pressure-sensitive medium. The indication of the pressure exerted by each interconnection is then analyzed to determine the quality of the connections of the electronic device. <IMAGE></p> |
申请公布号 |
EP1288668(A2) |
申请公布日期 |
2003.03.05 |
申请号 |
EP20020255349 |
申请日期 |
2002.07.31 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
BOHN, DAVID D. |
分类号 |
G01R31/04 |
主分类号 |
G01R31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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